CEN-Series Probe Cards

• Probe cards are made with NP probe materials.
• Suitable for Au bumps (LCD drivers), Al pads on memory, Circuit Under Pad (CUP),  low-k and other sensitive devices.
• Softness characteristic of NP probe provides the following benefits:
  • Less damage on pads after probing
  • Low contact force
  • Smaller scrub mark
  • Very stable contact resistance
  • Reduced online cleaning frequency

Ultra Fine Pitch

• Ultra fine pitch against gold bumps and aluminum pads. For the latest pitch specs, contact your JEM sales representative.
• By using a special tip treatment, we can achieve minimum scrub damage while maintaining good contact.
• Small-size probes allow a long-lasting service life due to dispersed stress in each probe.

High Speed

• Coaxial probes enable probing of high speed devices. For the latest bandwidth specs, contact your JEM sales representative.
• Coaxial probes can be connected to 50-ohm coaxial cable or SMA connectors.
• Regular non-coaxial probes for ground or power can be mounted along with the coaxial probes.

High Current

• Developed for power devices such as power transistors.
• Specially designed high-current, spring-loaded probes.