JEM America offers a line of Vertical Probe Cards suitable for a wide spectrum of probing applications. The biggest focus in our R&D efforts is in the area of vertical contact technology. Combining breakthroughs in interconnect technology and precision manufacturing techniques, our vertical probe cards can provide a number of performance benefits that are unattainable in the conventional cantilever probe cards. We are confident that our vertical probe cards are the reliable and cost-effective probing solution for the next-generation devices and the increasingly challenging test environment.   As our first vertical technology, VC-Series Probe Cards have achieved a proven track record for multi-die memory probing and wafer level burn-in as well as logic device probing. The VS-Series Probes Cards are developed for area array and solder/Cu bump probing applications.  And the VE-Series are for high parallelism testing of image sensor devices.

JEM's Vertical Probe Cards consist of four main components: Probe, Guide Plate, Space Transformer, and PCB.  If you are interested in learning individual product’s structure and specifications, please contact your JEM sales representative or JEM America directly.