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VC-Series

 

VS-Series

 

VE-Series

Multi-DUT Memory Devices (Flash, SDRAM)

Multi-DUT Logic Devices

Wafer Level Burn-In (8" Full Wafer)

Area Arrays

Flip Chips (C4)

Solder or Cu Bumps

Image Sensor Devices

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IEEE

SW Test Workshop

 

June 8 ~ June 11, 2014

San Diego, California, USA

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